公开(公告)号：US20220108868A1

公开(公告)日：2022-04-07

申请号：US17489989

申请日：2021-09-30

Applicant: SEMES CO., LTD.

Inventor： Duk Hyun SON ,  Yu Ri SON

IPC: H01J37/244 ,  H01J37/32 ,  G01N15/06

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a load lock chamber, of which a pressure of an interior space is changed between a first pressure and a second pressure that is lower than the first pressure, an index chamber connected to the load lock chamber, and a measurement unit that measures a level of particles in the interior space, and the measurement unit is located outside the load lock chamber.