DEVICE FOR MULTI-LEVEL PULSING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20220172927A1

    公开(公告)日:2022-06-02

    申请号:US17532082

    申请日:2021-11-22

    Abstract: Provided are an apparatus for multi-level pulsing, which minimizes power reflection when generating plasma using an RF signal having a plurality of pulsing levels, and a substrate processing apparatus including the same. The apparatus includes an RF signal generator for generating an RF signal including a first pulsing level and a second pulsing level that are different from each other, and a matching network for receiving the RF signal and providing a corresponding output signal to a load, wherein the RF signal generator generates the RF signal so that a first target impedance of the first pulsing level and a second target impedance of the second pulsing level are different from each other.

    Device for multi-level pulsing, substrate processing apparatus including the same

    公开(公告)号:US12087547B2

    公开(公告)日:2024-09-10

    申请号:US17532082

    申请日:2021-11-22

    CPC classification number: H01J37/32183 H01J37/32146 H01J37/3244

    Abstract: Provided are an apparatus for multi-level pulsing, which minimizes power reflection when generating plasma using an RF signal having a plurality of pulsing levels, and a substrate processing apparatus including the same. The apparatus includes an RF signal generator for generating an RF signal including a first pulsing level and a second pulsing level that are different from each other, and a matching network for receiving the RF signal and providing a corresponding output signal to a load, wherein the RF signal generator generates the RF signal so that a first target impedance of the first pulsing level and a second target impedance of the second pulsing level are different from each other.

Patent Agency Ranking