公开(公告)号：US20200168529A1

公开(公告)日：2020-05-28

申请号：US16203072

申请日：2018-11-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen ST. GERMAIN ,  Roger ARBUTHNOT ,  David BILLINGS ,  Andrew CELAYA

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H01L23/64 ,  H01L21/56

Abstract: Implementations of semiconductor packages may include: a substrate having one or more traces on a first side and one or more traces on a second side of the substrate. The substrate may be rigid. The packages may include at least one die mechanically and electrically coupled to the first side of the substrate. The die may be a high voltage die. The package may include one or more traces along one or more edges of the substrate. The one or more traces along the one or more edges of the substrate provide electrical connectivity between the one or more traces on the first side of the substrate and the one or more traces on the second side of the substrate. The package may also include a molding compound encapsulating at least the first and the one or more edges of the ceramic substrate.