公开(公告)号：US20240266264A1

公开(公告)日：2024-08-08

申请号：US18165545

申请日：2023-02-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hui Min LER ,  Swee Har KHOR ,  Ziming CHANG ,  Kok Yang LAU ,  Heng Giap ONG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49582 ,  H01L21/561 ,  H01L24/96 ,  H01L2224/95001 ,  H01L2224/96

Abstract: Implementations of a method of providing wettable flanks on leads of a semiconductor package may include applying mold compound around a plurality of leads included in a leadframe; electroplating exposed portions of the plurality of leads; cutting at least one lead of the plurality of leads to expose a flank of the least one lead; applying an electrically conductive layer over the plurality of leads; electroplating the flank of the at least one lead to render the flank wettable; removing the electrically conductive layer from the plurality of leads; and singulating to form a semiconductor package.