公开(公告)号：US20220254734A1

公开(公告)日：2022-08-11

申请号：US17660941

申请日：2022-04-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Erik Nino TOLENTINO ,  Yusheng LIN ,  Swee Har KHOR

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/48

Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

公开(公告)号：US20170062310A1

公开(公告)日：2017-03-02

申请号：US14842571

申请日：2015-09-01

Applicant: Semiconductor Components Industries, LLC

Inventor： Swee Har KHOR ,  Tian Hing LIM ,  Hui Min LER ,  Chee Hiong CHEW ,  Phillip CELAYA

IPC: H01L23/495 ,  H01L23/00

Abstract: In one embodiment, methods for making semiconductor devices are disclosed.

Abstract translation: 在一个实施例中，公开了制造半导体器件的方法。

公开(公告)号：US20240266264A1

公开(公告)日：2024-08-08

申请号：US18165545

申请日：2023-02-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hui Min LER ,  Swee Har KHOR ,  Ziming CHANG ,  Kok Yang LAU ,  Heng Giap ONG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49582 ,  H01L21/561 ,  H01L24/96 ,  H01L2224/95001 ,  H01L2224/96

Abstract: Implementations of a method of providing wettable flanks on leads of a semiconductor package may include applying mold compound around a plurality of leads included in a leadframe; electroplating exposed portions of the plurality of leads; cutting at least one lead of the plurality of leads to expose a flank of the least one lead; applying an electrically conductive layer over the plurality of leads; electroplating the flank of the at least one lead to render the flank wettable; removing the electrically conductive layer from the plurality of leads; and singulating to form a semiconductor package.

公开(公告)号：US20200144200A1

公开(公告)日：2020-05-07

申请号：US16181876

申请日：2018-11-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Erik Nino TOLENTINO ,  Chee Hiong CHEW ,  Yusheng LIN ,  Swee Har KHOR

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/78

Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

公开(公告)号：US20200312749A1

公开(公告)日：2020-10-01

申请号：US16903706

申请日：2020-06-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Swee Har KHOR ,  Tian Hing LIM ,  Hui Min LER ,  Chee Hiong CHEW ,  Phillip CELAYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/60

Abstract: In one embodiment, methods for making semiconductor devices are disclosed.

公开(公告)号：US20200294935A1

公开(公告)日：2020-09-17

申请号：US16886395

申请日：2020-05-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Erik Nino TOLENTINO ,  Chee Hiong CHEW ,  Yusheng LIN ,  Swee Har KHOR

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/48

Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.