公开(公告)号：US20230025520A1

公开(公告)日：2023-01-26

申请号：US17816797

申请日：2022-08-02

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  I-Lin CHU

IPC: H01L27/146 ,  H01L31/0203

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.

公开(公告)号：US20200312897A1

公开(公告)日：2020-10-01

申请号：US16506497

申请日：2019-07-09

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  I-Lin CHU

IPC: H01L27/146 ,  H01L31/0203

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.

公开(公告)号：US20240405043A1

公开(公告)日：2024-12-05

申请号：US18799472

申请日：2024-08-09

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  I-Lin CHU

IPC: H01L27/146 ,  H01L31/0203

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.