公开(公告)号：US20250006589A1

公开(公告)日：2025-01-02

申请号：US18747029

申请日：2024-06-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： John MOOKKEN

IPC: H01L23/473 ,  H01L23/373 ,  H01L23/495

Abstract: A fluid-cooled power module is disclosed for cooling high power semiconductor devices. Semiconductor dies supported by a direct-bonded metal structure are attached to a cooling unit that circulates coolant from an inner chamber, through spray jets, to an outer chamber, so that coolant impinges onto a metal surface in thermal contact with the direct-bonded metal structure. Use of the cooling fluid provides more efficient and cost effective cooling than relying on a solid metal heat sink. The disclosed fluid-cooled power modules can reduce the cost and weight of heat dissipation for compatibility with aerospace applications.

公开(公告)号：US20240047304A1

公开(公告)日：2024-02-08

申请号：US18167998

申请日：2023-02-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： John MOOKKEN

IPC: H01L23/473

CPC classification number: H01L23/4735

Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.