MICROLENS DEVICE AND RELATED METHODS

    公开(公告)号:US20210197506A1

    公开(公告)日:2021-07-01

    申请号:US16836693

    申请日:2020-03-31

    Abstract: Implementations of semiconductor devices may include: a microlens array formed of a plurality of microlenses. Each of the plurality of microlenses may have a first side and a second side. A layer of polymer may be formed over the second side of each of the plurality of microlenses and a low index box may be between adjacent microlenses of the plurality of microlenses.

    SYSTEMS AND METHODS FOR ELECTRICAL CHARGE DISSIPATION

    公开(公告)号:US20210098393A1

    公开(公告)日:2021-04-01

    申请号:US16662041

    申请日:2019-10-24

    Inventor: Min JANG

    Abstract: A system and method of charge dissipation by embedded metal connection that includes an image sensor is disclosed. Specific implementations include a semiconductor substrate, an antireflective coating (ARC) layer coupled over the semiconductor substrate, a charge dissipation structure included within the ARC layer, and a passivation layer coupled over the ARC layer.

    MULTI-LAYERED MICROLENS SYSTEMS AND RELATED METHODS

    公开(公告)号:US20210202559A1

    公开(公告)日:2021-07-01

    申请号:US16951091

    申请日:2020-11-18

    Inventor: Min JANG

    Abstract: Implementations of a microlens system may include a first layer including a first refractive index, the first layer including one or more substantially hemispherical elements formed therein; a second layer including a second refractive index coupled over the substantially hemispherical elements of the first layer; and a third layer including a third refractive index coupled over the second layer. A value of the first refractive index may be larger than a value of the third refractive index and a value of the second refractive index and the value of the second refractive index may be less than a value of the third refractive index.

Patent Agency Ranking