公开(公告)号：US11776871B2

公开(公告)日：2023-10-03

申请号：US17247525

申请日：2020-12-15

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Leo Gu ,  Sixin Ji ,  Jie Chang ,  Keunhyuk Lee ,  Yong Liu

IPC: H01L23/373 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3735 ,  H01L21/4871 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32237 ,  H01L2224/83815

Abstract: In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.