公开(公告)号：US20240044701A1

公开(公告)日：2024-02-08

申请号：US18234580

申请日：2023-08-16

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Li-Chien Su ,  Yen-Wei Liao ,  Yuan-Ching Hsu

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

CPC classification number: G01J1/4204 ,  G01J1/0295 ,  G01J1/0437

Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.