公开(公告)号：US20230294389A1

公开(公告)日：2023-09-21

申请号：US18184831

申请日：2023-03-16

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam KIM ,  Hong Il YOO ,  Jong Yup LEE ,  Chul-Keun PARK

IPC: B32B37/24 ,  B32B7/12 ,  B32B15/04

CPC classification number: B32B37/24 ,  B32B7/12 ,  B32B15/043 ,  H01Q1/38

Abstract: A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.