公开(公告)号：US20230396187A1

公开(公告)日：2023-12-07

申请号：US18129320

申请日：2023-03-31

Applicant: SENTEC E&E CO., LTD.

Inventor： Jason An Cheng Huang ,  Liang-Yo Chen ,  Kun-Tzu Chen ,  Nai-Hsi Hu

IPC: H02M7/5387 ,  H05K7/14

CPC classification number: H02M7/53871 ,  H05K7/14322 ,  H02M7/003

Abstract: A power module includes two power input terminals, two main substrates, a plurality of first switches, a plurality of second switches, and a bridge main unit. The bridge main unit is across the two main substrates, and includes a first bridge subunit and a second bridge subunit. Each of the first bridge subunit and the second bridge subunit includes a first conducting region on a bottom surface, and a second conducting region and a third conducting region on a top surface. The first conducting region transmits a current signal of a current path of a switch circuit formed by the power input terminals, the first switches, and the second switches. The second conducting region is connected to the control terminals of the first switches and the second switches. The third conducting region is connected to the output terminals of the first switches and the second switches.