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公开(公告)号：US12089333B2
公开(公告)日：2024-09-10
申请号：US17295582
申请日：2019-11-20
申请人： SENTEC LTD
发明人： Andrew Nicholas Dames , Dawei Zhi , Joseph Adam
CPC分类号： H05K1/165 , G01R15/185 , G01R21/06 , H05K1/0259 , H05K1/115
摘要： An electricity meter (17) is described which includes a conductor (19) for transferring energy from a supply (20) to a load (21). The electricity meter (17) also includes a multi-layer printed circuit board (18) mechanically attached to the conductor (19). The multi-layer printed circuit board (18) includes two or more insulating layers (26, 27, 33, 34). The two or more insulating layers (26, 27, 33, 34) include a first insulating layer (26, 27) having an attachment surface (28) facing the conductor (19). The multi-layer printed circuit board (18) also includes a first conductive layer (29) including a first planar sensor coil (30). The first insulating layer (26, 27) is between the first conductive layer (29) and the conductor (19). The multi-layer printed circuit board (18) also includes a second conductive layer (31) including a second planar sensor coil (32). The multi-layer printed circuit board (18) also includes a second insulating layer (26, 33) between the first (29) and second (31) conductive layers. The first planar sensor coil (30) and the second planar sensor coil (32) are electrically connected to one another by a buried via (40), or the first planar sensor coil (30) and the second planar sensor coil (32) are electrically connected to one another by a blind via (38) extending inwards from a back surface (35) of the multi-layer printed circuit board (18), the back surface (35) being opposed to the attachment surface (28).
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公开(公告)号：US20220022322A1
公开(公告)日：2022-01-20
申请号：US17295582
申请日：2019-11-20
申请人： SENTEC LTD
发明人： Andrew Dames , Dawei Zhi , Joseph Adam
摘要： An electricity meter (17) is described which includes a conductor (19) for transferring energy from a supply (20) to a load (21). The electricity meter (17) also includes a multi-layer printed circuit board (18) mechanically attached to the conductor (19). The multi-layer printed circuit board (18) includes two or more insulating layers (26, 27, 33, 34). The two or more insulating layers (26, 27, 33, 34) include a first insulating layer (26, 27) having an attachment surface (28) facing the conductor (19). The multi-layer printed circuit board (18) also includes a first conductive layer (29) including a first planar sensor coil (30). The first insulating layer (26, 27) is between the first conductive layer (29) and the conductor (19). The multi-layer printed circuit board (18) also includes a second conductive layer (31) including a second planar sensor coil (32). The multi-layer printed circuit board (18) also includes a second insulating layer (26, 33) between the first (29) and second (31) conductive layers. The first planar sensor coil (30) and the second planar sensor coil (32) are electrically connected to one another by a buried via (40), or the first planar sensor coil (30) and the second planar sensor coil (32) are electrically connected to one another by a blind via (38) extending inwards from a back surface (35) of the multi-layer printed circuit board (18), the back surface (35) being opposed to the attachment surface (28).
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