公开(公告)号：US20240240296A1

公开(公告)日：2024-07-18

申请号：US18413467

申请日：2024-01-16

Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Eun Soo PARK ,  Wookha RYU ,  Kyungjun KIM ,  Kook Noh YOON ,  Wan KIM

IPC: C22C45/02 ,  C22C33/00 ,  H01F1/153

CPC classification number: C22C45/02 ,  C22C33/003 ,  H01F1/15308

Abstract: The present disclosure relates to a complex concentrated soft magnetic amorphous alloy with multi-complex quenched-in nuclei and a method for manufacturing the same, and more specifically, to a complex concentrated soft magnetic amorphous alloy which exhibits low coercivity while improving glass forming ability through the design of configurational entropy control complex alloying composition of a first main element group (Fe, Co, Ni), which determines the degree of magnetization as ferromagnetic metallic elements, a second alloying element group (B, Si, P, C), which facilitates amorphous formation, and a third cluster element group (Ca, Cu, Ag), which forms multi-complex quenched-in nuclei, and a method for manufacturing the same.
The complex concentrated soft magnetic amorphous alloy developed in the present disclosure is characterized by having an excellent switching effect in which the alloy is easily magnetized and demagnetized when a magnetic field is applied and removed by implementing low coercivity. In addition, the present disclosure provides guidelines for alloy development to develop a new alloy with excellent functionality realized by applying a complex concentrated alloy design method to amorphous alloy design. In addition, the present disclosure has presented a step of performing a precise heat treatment based on the (time)-(temperature)-(transformation) curve measurement of the manufactured complex concentrated soft magnetic amorphous alloy, thereby presenting a method capable of effectively controlling an amorphous structure control that has been optimized through the existing trial and error method based on the prediction.

公开(公告)号：US20160045953A1

公开(公告)日：2016-02-18

申请号：US14828232

申请日：2015-08-17

Applicant: SK INNOVATION CO., LTD. ,  Seoul National University R&DB Foundation

Inventor： Eun Soo PARK ,  Wan KIM ,  Jinwoo KIM ,  Chae Woo RYU

IPC: B22D11/06 ,  B22D11/00 ,  C22C45/10 ,  B22D25/02

CPC classification number: B22D11/0611 ,  B22D11/001 ,  B22D25/02 ,  C22C1/002 ,  C22C45/10

Abstract: Disclosed herein is a flexible substrate, made of metallic glass that is of high resilience suitable for use in electronic devices. The metallic glass is composed of a commercial alloy that can be produced in a continuous process on a mass scale, and may be selected from among Mg-, Ca-, Al-, Ti-, Zr-, Hf-, Fe-, Co-, Ni-, and Cu-based metallic glass. Preferably, its crystallization temperature, which determines the process allowable temperature, is 200° C. or higher. The flexible metallic glass substrate exhibits excellent fatigue properties as well as resilience of 1.5 MJ/m3 or higher. Its coefficient of thermal expansion is within a small range of 1 to 20 ppm/° C., so that the flexible metallic glass substrate shows a better interfacial property with electronic devices.

Abstract translation: 本文公开了一种柔性基底，由适用于电子设备的高回弹性的金属玻璃制成。 金属玻璃由可以大规模连续生产的商品合金构成，可以选自Mg-，Ca-，Al-，Ti-，Zr-，Hf-，Fe-，Co - ，Ni-和Cu-基金属玻璃。 优选地，其结晶温度（其确定工艺允许温度）为200℃或更高。 柔性金属玻璃基板具有优异的疲劳性能以及1.5MJ / m 3以上的弹性。 其热膨胀系数在1〜20ppm /℃的小范围内，使得柔性金属玻璃基板与电子器件表现出更好的界面性能。