公开(公告)号：US20210280373A1

公开(公告)日：2021-09-09

申请号：US16926324

申请日：2020-07-10

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn Len ,  Hong Zong Xu ,  Zhi Xian Xu ,  Hsing Tsai Huang ,  Jie-An Zhu

IPC: H01G4/224 ,  H01G4/30

Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.