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公开(公告)号：US10095132B2
公开(公告)日：2018-10-09
申请号：US15554184
申请日：2016-02-24
发明人： Xiaoyu Jiang , Changgang Wang
摘要： A reticle transfer apparatus includes a reticle, a reticle stage (4) and a robot (2). The robot (2) is configured to support, transport and transfer the reticle onto the reticle stage (4). The apparatus further includes: a first set of marks (52) and a second set of marks (53), both provided on the reticle; a pre-alignment unit (3), disposed on one side of the reticle stage (4) and configured to perform a first pre-alignment process by detecting the first set of marks (52) and perform a second pre-alignment process by detecting the second set of marks (53) during the transfer of the reticle; and a control unit, configured to adjust the position of the reticle relative to the reticle stage (4) based on the results of the first pre-alignment process such that the reticle is prevented from colliding with the reticle stage (4) and to adjust the position of the reticle relative to the reticle stage (4) based on the results of the second pre-alignment process such that the reticle is positioned in a predetermined range relative to the reticle stage (4). A reticle transfer method is also disclosed.
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公开(公告)号：US10658327B1
公开(公告)日：2020-05-19
申请号：US16338260
申请日：2017-09-26
发明人： Tianming Wang , Xiaoyu Jiang , Hai Xia , Feibiao Chen
IPC分类号： H01L23/00
摘要： Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.
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公开(公告)号：US10763235B2
公开(公告)日：2020-09-01
申请号：US16338551
申请日：2017-09-26
发明人： Xiaoyu Jiang , Hai Xia , Feibiao Chen , Song Guo
IPC分类号： H01L23/00 , H01L21/67 , H01L23/544
摘要： A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.
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公开(公告)号：US11309209B2
公开(公告)日：2022-04-19
申请号：US16499695
申请日：2018-03-29
发明人： Gang Wang , Rongjun Zhang , Xiaoyu Jiang , Yichao Shi , Kai Liu , Junpeng Chen
IPC分类号： H01L21/68 , H01L21/683 , B65G47/91 , H01L21/67 , H01L21/677
摘要： A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
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公开(公告)号：US11081380B2
公开(公告)日：2021-08-03
申请号：US16489198
申请日：2018-02-27
发明人： Feibiao Chen , Hai Xia , Yuebin Zhu , Hailin Cheng , Xiaoyu Jiang , Lili Zhao , Donghao Zhang
IPC分类号： H01L21/68 , B65G47/91 , H01L21/677 , H01L21/683 , H01L21/67
摘要： A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.
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