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1.发明授权公开(公告)号：US12104970B2
公开(公告)日：2024-10-01
申请号：US17639247
申请日：2019-08-30
发明人： Hao Li , Xuepeng Lin
IPC分类号： G01L1/22
CPC分类号： G01L1/2281 , G01L1/2262 , G01L1/2293
摘要： A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.
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公开(公告)号：US12055451B2
公开(公告)日：2024-08-06
申请号：US17639230
申请日：2019-08-30
发明人： Hao Li , Xuepeng Lin
IPC分类号： G01L1/22 , G01L5/1627
CPC分类号： G01L1/2293 , G01L1/2262 , G01L5/1627
摘要： A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.
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公开(公告)号：US11940337B2
公开(公告)日：2024-03-26
申请号：US17416384
申请日：2018-12-20
发明人： Hao Li , Xuepeng Lin
IPC分类号： G01L1/18
CPC分类号： G01L1/18
摘要： The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.
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公开(公告)号：US12078559B2
公开(公告)日：2024-09-03
申请号：US17682982
申请日：2022-02-28
发明人： Hao Li , Xuepeng Lin
IPC分类号： G01L1/22
CPC分类号： G01L1/2293
摘要： A pressure sensing assembly, a pressure sensing method, and a device having the pressure sensing assembly are disclosed. The detection circuit and the signal generating circuit are connected to a signal processing circuit, the detection circuit includes a first bridge circuit constituted by connecting at least four force sensors R1, R2, R3 and R4. During use, the rigid structure is attached on an object to be detected which is deformed under action of an acting force, the detection circuit and the signal generating circuit are cooperated so as to generate different output signals that pass through the signal processing circuit, so that a direction and a magnitude of the acting force is recognized. The pressure sensing assembly has an integrated structure, is prone to be assembled, has a simple circuit configuration, and is low in cost.
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