公开(公告)号：US20030173020A1

公开(公告)日：2003-09-18

申请号：US10369725

申请日：2003-02-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Eiichi Ishiyama

IPC: B44C001/00

CPC classification number: G02F1/1341 ,  G02F2001/13415

Abstract: For the vacuum pumping performed for a chamber, the opening of a valve communicating with a vacuum pump is controlled to change the intake resistance of a pipe from high to low, and to suppress an exhaust air stream occurring when vacuum pumping is started. Further, in the process (vacuum venting) for recovering the atmospheric pressure in the chamber, a recovery valve is controlled to change, from high to low, the inflow resistance of a gas introduced into the chamber, so that the amount of the gas introduced into the chamber 2 at the beginning of the vacuum venting is reduced. Therefore, since the air stream in the chamber 2 can be moderated during the vacuum pumping and the vacuum venting, the deterioration of the electric characteristics of the substrates by the stirring up of dust in the chamber and the attachment of the dust to the substrates can be avoided, and high-quality laminated substrates can be provided at a high manufacturing yield.

Abstract translation: 为了对室进行真空抽吸，控制与真空泵连通的阀的开度，以将管的进气阻力从高变为低，并且抑制当真空泵送开始时发生的排气流。 此外，在用于回收室内的大气压力的过程（真空排气）中，控制回收阀从高到低将导入室的气体的流入阻力改变，使得引入的气体的量 在真空排气开始时进入腔室2减少。 因此，由于在真空抽吸和真空排气过程中腔室2中的空气流可以缓和，所以通过搅拌室内的灰尘和将灰尘附着在基板上而导致的基板的电特性的劣化 可以以高的制造成品率提供高质量的层合基板。