公开(公告)号：US20240321623A1

公开(公告)日：2024-09-26

申请号：US18613488

申请日：2024-03-22

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yoshihiro KUSUBE

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68785

Abstract: According to one embodiment, a mounting tool and a mounting apparatus that can be used for the electronic components with different sizes without changing a shape thereof and can reduce remaining air bubbles when mounting the electronic component on the substrate are provided. A mounting tool 31 of the embodiment includes: a holder 311 including a holding surface 311a configured to hold an inner side of the electronic component 2 inside a pair of opposite outer edges of the electronic component 2; an expanded portion 312 including an opposing surface that is facing away from an overhang portion 2c of the electronic component 2 that protrudes outward than the outer edge of the holding surface 311a of the holder 311 and is not held by the holder 311; a first opening 313 provided in the holding surface 311a; a second opening 315 provided in the opposing surface 312a; a first ventilation path 314 configured to communicate with the first opening 313 and to suck and hold the electronic component 2 at the holding surface 311a by creating negative internal pressure; and a second ventilation path 316 that sucks the overhang portion 2c of the electronic component 2 facing the opposing surface 312a by creating negative internal pressure.