公开(公告)号：US20040262373A1

公开(公告)日：2004-12-30

申请号：US10875285

申请日：2004-06-25

Applicant: SHIBUYA KOGYO CO., LTD

Inventor： Kensei Murata

IPC: B23K001/00

CPC classification number: B23K3/0607 ,  H01L21/4853 ,  H05K3/3478 ,  H05K3/3489

Abstract: A flux is supplied from a flux transfer head having a flux transfer pin to a predetermined position on a substrate, and then a solder ball is mounted on the predetermined position by a solder ball mounting head having a suction nozzle. The solder ball mounting head and the flux transfer head are provided alternately on a head supporter. When the rotation of the head supporter is stopped, sucking a solder ball suction by the suction nozzle, depositing the flux on a free end of the flux transfer pin, transferring the flux to the substrate by the flux transfer pin, and mounting the solder ball on the predetermined position by the ball mounting head, and examining whether the solder ball exists on the suction nozzle by which the ball mounting operation has just carried out are executed.

Abstract translation: 从具有磁通传递销的磁通传递头向基板上的预定位置供给磁通，然后通过具有吸嘴的焊球安装头将焊球安装在预定位置上。 焊球安装头和焊剂转移头交替地设置在头部支撑件上。 当头部支撑件的旋转停止时，通过吸嘴抽吸焊球吸引，将助熔剂沉积在助焊剂传递销的自由端上，通过助焊剂传送销将助焊剂转移到衬底，并安装焊球 通过球安装头在预定位置上，并且检查焊球是否存在于刚刚执行球安装操作的吸嘴上。