公开(公告)号：US11910534B2

公开(公告)日：2024-02-20

申请号：US17312388

申请日：2019-12-09

申请人： SHINKAWA LTD.

发明人： Tomonori Nakamura ,  Koji Matsushita ,  Hiroshi Omata ,  Masahito Tsuji ,  Keiichi Hiruma ,  Mitsuteru Sakamoto ,  Ryo Urahashi ,  Takaya Kinjo ,  Shota Nakano ,  Akira Sekikawa

IPC分类号： H05K13/08

CPC分类号： H05K13/083 ,  H05K13/081

摘要： A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.