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公开(公告)号：US20240134352A1
公开(公告)日：2024-04-25
申请号：US18547519
申请日：2021-03-09
申请人： FUJI CORPORATION
发明人： Yusuke YAMAZAKI , Yuji KAWASAKI
IPC分类号： G05B19/4155 , H05K13/02 , H05K13/08
CPC分类号： G05B19/4155 , H05K13/02 , H05K13/081 , G05B2219/39241
摘要： A maintenance device is applied to a bulk feeder including a feeder main body section, a track member, a vibration device, and a cavity group, and includes an initialization section and a vibration force control section. When the use time of the bulk feeder elapses a predetermined time, the initialization section returns a supply component existing in the cavity group toward a receiving region, and sets the cavity group to an initialization state in which the supply component does not exist in the cavity group. The vibration force control section increases the vibration force to be applied by the vibration device to the track member in the initialization section as compared with a case where the supply component is returned from the supply region toward the receiving region in order to adjust the number of the supply components conveyed to the cavity group when a board product is produced.
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公开(公告)号：US20240083692A1
公开(公告)日：2024-03-14
申请号：US18261951
申请日：2021-01-29
申请人： FUJI CORPORATION
CPC分类号： B65G47/14 , H05K13/02 , H05K13/081 , B65G2203/0233 , B65G2203/041
摘要： A component supply control system includes a state recognition section configured to derive a supply state of a component for each of multiple areas set in advance in a supply region based on image data acquired by imaging the supply region in a state in which a bulk feeder has conveyed multiple components to the supply region by vibration, and a conveyance control section configured to control a conveyance operation of the components in the bulk feeder based on the supply state for each of the multiple areas.
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公开(公告)号：US20180335295A1
公开(公告)日：2018-11-22
申请号：US15794707
申请日：2017-10-26
申请人： APPLEJACK 199 L.P.
发明人： Wojciech J. WALECKI
CPC分类号： G01B11/16 , G01B11/0608 , G01B11/24 , H05K13/081
摘要： An apparatus and a method for measuring surface topography of a work-piece are described. The apparatus comprises a light emitting assembly configured to emit an emitted beam of light, the emitted beam being emitted at a plurality of wavelengths and modulated at modulating frequency, the emitted beam being directed onto a surface of a work-piece. A detector is configured to receive a reflected beam of light that includes at least a portion of the emitted beam as reflected from the surface of the work-piece. The detector is further configured to generate a signal indicative of a position of the reflected beam on the detector. A signal processing unit is configured to remove noise from the signal thus generated based on the modulating frequency to obtain a processed signal. A control unit is configured to determine topography of the surface based on the processed signal.
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公开(公告)号：US20160198597A1
公开(公告)日：2016-07-07
申请号：US14880464
申请日：2015-10-12
CPC分类号： H05K13/0417 , B65H37/002 , B65H2701/1942 , H05K13/0419 , H05K13/08 , H05K13/081
摘要： An electronic component supply apparatus transports a component supply tape which has accommodation sections and sprocket holes formed at regular intervals and which accommodates electronic components in the accommodation sections and is covered with a cover tape, to a component picking-up position and supplies each of the electronic components accommodated in each of the accommodation sections to a component mounting apparatus. The electronic component supply apparatus includes an electronic component detecting unit that detects the electronic component accommodated in the accommodation section of the component supply tape which has yet to pass the cover tape processing unit on a transport path; a determination unit that determines presence or absence of an electronic component in the accommodation section based on information from the electronic component detecting unit; and a control unit that controls a component supply tape transport unit based on a determination result of the determination unit.
摘要翻译： 电子部件供给装置输送具有以规则间隔形成的容纳部和链轮孔的部件供给带，并将其容纳在收容部中的电子部件并且被覆盖带覆盖到部件接收位置，并且将每个 容纳在每个容纳部分中的电子部件到部件安装装置。 电子部件供给装置具备电子部件检测部，该电子部件检测部检测容纳在传送路径上尚未通过盖带处理部的部件供给带的收纳部中的电子部件; 确定单元，其基于来自所述电子部件检测单元的信息来确定所述容纳部中的电子部件的存在或不存在; 以及控制单元，其基于所述确定单元的确定结果来控制部件供应带传送单元。
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公开(公告)号：US06374986B1
公开(公告)日：2002-04-23
申请号：US09593801
申请日：2000-06-15
申请人： Kunio Oe
发明人： Kunio Oe
IPC分类号： B65G4714
CPC分类号： B65G47/1457 , B65G15/58 , B65G2201/02 , B65G2203/044 , H05K13/028 , H05K13/0417 , H05K13/081
摘要： An object supplying apparatus, including a housing, pulleys which are rotatable about respective substantially horizontal axis lines and at least one of which is provided in the housing, a conveyor belt which has a plurality of pockets provided in a surface thereof and arranged in a lengthwise direction thereof, and which is wound on the pulleys such that a portion of the belt extends in a substantially horizontal direction and the pockets provided in the portion of the belt open upward, a circulative lifter which is circulated on a substantially vertical plane in the housing, and which has at least one holder which holds at least one of a plurality of objects present in a lower portion of the housing, conveys the object upward, and releases the object at an object-release position in the housing, a guide device which is provided below the object-release position and which guides the object toward the portion of the conveyor belt, and a clearing device which clears, from the portion of the conveyor belt, the object which has not been accommodated in any of the pockets of the portion of the belt and is present on the portion of the belt.
摘要翻译： 一种物体供给装置，包括壳体，滑轮，其可围绕相应的大致水平的轴线旋转，并且其中至少一个设置在壳体中;传送带，其具有设置在其表面中并沿纵向布置的多个凹穴 并且其被缠绕在滑轮上，使得皮带的一部分沿基本上水平的方向延伸，并且设置在皮带部分中的口袋向上敞开，循环的提升器在壳体中在基本上垂直的平面上循环 并且其具有至少一个保持件，其保持存在于壳体的下部中的多个物体中的至少一个，向上运送物体，并将物体在壳体中的物体释放位置处释放;引导装置， 设置在物体释放位置的下方，并且朝向传送带的部分引导物体，以及清除装置，其从部分 传送带，该物体未被容纳在带的该部分的任何凹穴中并存在于该带的部分上。
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公开(公告)号：US11910534B2
公开(公告)日：2024-02-20
申请号：US17312388
申请日：2019-12-09
申请人： SHINKAWA LTD.
发明人： Tomonori Nakamura , Koji Matsushita , Hiroshi Omata , Masahito Tsuji , Keiichi Hiruma , Mitsuteru Sakamoto , Ryo Urahashi , Takaya Kinjo , Shota Nakano , Akira Sekikawa
IPC分类号： H05K13/08
CPC分类号： H05K13/083 , H05K13/081
摘要： A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.
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公开(公告)号：US11747391B2
公开(公告)日：2023-09-05
申请号：US17629032
申请日：2020-06-18
CPC分类号： G01R31/2813 , G01R31/2829 , G01R31/71 , H05K13/081 , H05K13/082
摘要： A method for detecting errors or malfunctions in electrical or electronic components of circuits, wherein each of the circuits is located on a circuit board and wherein a plurality of circuit boards border one another on a circuit board panel, includes populating each of the circuit boards of the circuit board panel with electrical or electronic components corresponding to the circuits; for each of the analog, electrical or electronic components used for the construction of the circuits, placing a corresponding test component in an edge region of the circuit board panel; providing the analog, electrical or electronic test components placed in the edge region of the circuit board panel with test points; and checking for the correct function value and/or the correct poling of the analog, electrical or electronic test components provided with test points and located in the edge region of the circuit board panel.
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公开(公告)号：US20170285545A1
公开(公告)日：2017-10-05
申请号：US15507483
申请日：2014-09-04
发明人： Toshihiro KODAMA
CPC分类号： G03G15/5054 , B65G43/02 , B65G2203/0233 , B65G2203/0266 , B65G2203/0275 , B65G2203/042 , B65G2203/044 , B65G2811/0673 , G03G2215/00059 , H01L21/67259 , H01L21/67288 , H01L21/67706 , H05K13/0061 , H05K13/08 , H05K13/081
摘要： A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts. The board conveyance device includes: endless conveyance belts on which is set a conveyance path for conveying a board; a board sensor configured to detect the presence of the board at a specified detection position on the conveyance path; and a control section configured to, in a case in which the board is not being conveyed on the conveyance path, move the conveyance belts and determine a problem with the conveyance belts based on a detection result of the board sensor.
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公开(公告)号：US20160249499A1
公开(公告)日：2016-08-25
申请号：US15017170
申请日：2016-02-05
发明人： Hideki SUMI
CPC分类号： H05K13/0413 , H05K13/0417 , H05K13/08 , H05K13/081
摘要： A component mounting method performs suction and holing, by a suction nozzle, of a component fed to a component picking-up position by a tape feeder which feeds by pitch a carrier tape having a pocket in which the component is accommodated, after a predetermined delay time elapses after a pitch feeding timing, and carries and mounts the component on a board. The component mounting method includes imaging a tape position indicating portion at separate two timings after the delay time elapses, and calculating a shift amount between a first and second tape positions respectively obtained at first and second timings of imaging. It is determined whether or not the shift amount calculated is within an allowable range, and when it is determined that the shift amount exceeds the allowable range, the delay time set for the tape feeder is extended or an error is notified.
摘要翻译： 部件安装方法通过吸嘴将进给到部件拾取位置的部件通过带式进料器进行抽吸和打孔，所述带式进料器在经过预定延迟之后通过间距馈送具有容纳有部件的口袋的载带 时间间隔过后，并将组件携带并安装在电路板上。 部件安装方法包括在经过延迟时间之后以分离的两个定时对带位置指示部分进行成像，并且计算分别在第一和第二成像定时时间获得的第一和第二带位置之间的偏移量。 确定所计算的移动量是否在允许范围内，并且当确定移动量超过允许范围时，为带式馈送器设置的延迟时间被延长或者通知错误。
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公开(公告)号：US08181337B2
公开(公告)日：2012-05-22
申请号：US12349249
申请日：2009-01-06
申请人： Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama
发明人： Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama
IPC分类号： H01R43/00
CPC分类号： H05K13/0215 , H05K13/0419 , H05K13/081 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49146 , Y10T29/53174 , Y10T29/53178
摘要： A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.
摘要翻译： 将电子部件安装在印刷电路板上的方法包括提供包括第一部分和第二部分的存储带，所述第一部分和第二部分通过连接带连接并包含存储在其中的电子部件，使存储带前进，使得电子部件前进到 部件拾取位置，其中电子部件由吸嘴吸取，通过吸嘴从部件拾取位置拾起高级电子部件，并将拾取的电子部件安装在印刷电路板上。 重复存储带的推进，电子部件的拾取和电子部件的安装，并且当存储带的第二部分前进到部件拾取位置时，调整部件拾取位置。
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