公开(公告)号：US12057384B2

公开(公告)日：2024-08-06

申请号：US17526089

申请日：2021-11-15

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiroshi Taneda ,  Kei Imafuji ,  Yoshiki Akiyama ,  Kensuke Uchida

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L23/49822 ,  H01L23/49833

Abstract: A wiring substrate includes a bendable portion including one or more wiring layers and insulation layers that are alternately stacked. The insulation layers of the bendable portion include a first insulation layer and a second insulation layer. The first insulation layer is located at an inner bent position of the bendable portion when the bendable portion is bent. The second insulation layer is located at an outer bent position of the bendable portion relative to the first insulation layer when the bendable portion is bent. The first insulation layer has a higher elastic modulus than the second insulation layer.

公开(公告)号：US20250054847A1

公开(公告)日：2025-02-13

申请号：US18798016

申请日：2024-08-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kensuke Uchida

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A wiring board includes an insulating layer and a connection terminal that is formed on a surface of the insulating layer. The connection terminal includes a metal pad that is embedded in the insulating layer and a plated layer that covers an end face of the pad that is exposed on the surface of the insulating layer. The end face of the pad is depressed in a concave surface form to a position lower than the surface of the insulating layer and a surface of the plated layer on a side opposite to a surface making contact with the end face of the pad is depressed in the concave surface form toward the end face.