公开(公告)号：US20230120515A1

公开(公告)日：2023-04-20

申请号：US18046557

申请日：2022-10-14

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hikaru TANAKA ,  Takashi KASUGA ,  Tomoyuki SHIMODAIRA ,  Hitoshi KONDO

IPC: H01L23/532 ,  H01L23/482 ,  H01L23/522

Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

公开(公告)号：US20230123522A1

公开(公告)日：2023-04-20

申请号：US17937831

申请日：2022-10-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hikaru TANAKA ,  Takashi KASUGA ,  Tomoyuki SHIMODAIRA ,  Hitoshi KONDO

IPC: H05K1/11

Abstract: A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.