公开(公告)号：US20140309326A1

公开(公告)日：2014-10-16

申请号：US14317710

申请日：2014-06-27

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Ritsuko AZUMA

IPC: H05K1/03

CPC classification number: H05K1/0346 ,  C08G18/3212 ,  C08G18/718 ,  C08G18/8019 ,  C08G18/8116 ,  C09D175/16 ,  H05K3/287

Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):

Abstract translation: 提供一种可聚合化合物，可光固化组合物和用于安装电路板的光固化防潮绝缘涂层材料，其降低环境影响，在低照射剂量下表面固化性优异，并且对基材材料具有高粘合性。 根据本发明的化合物具有衍生自二聚二醇的结构单元，并且具有作为端基的由式（1）表示的基团：其中R 1表示H或CH 3，R 2表示具有2至12个碳原子的烃基 ，在结尾。 优选地，化合物具有作为端基的由式（1）表示的基团和由式（2）表示的基团：其中R 3各自独立地表示CH 3或CH 2 CH 3，并且R 4表示具有3至9个碳原子的烃基， 在最后。 具有来自二聚二醇的结构单元的结构优选由式（3）表示：