公开(公告)号：US20220230918A1

公开(公告)日：2022-07-21

申请号：US17605138

申请日：2019-04-24

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Yoshinori EJIRI ,  Hideo NAKAKO ,  Yuki KAWANA ,  Motoki YONEKURA ,  Shinichirou SUKATA ,  Manabu ISHII ,  Masaru FUJITA ,  Michiko NATORI ,  Masahiro KIMURA ,  Ryo HONNA

IPC: H01L21/768 ,  H01L23/48

Abstract: An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.

公开(公告)号：US20230391983A1

公开(公告)日：2023-12-07

申请号：US18255237

申请日：2021-12-02

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Motoki YONEKURA ,  Motohiro ARIFUKU ,  Kosuke URASHIMA

IPC: C08K3/22

CPC classification number: C08K3/22 ,  C08K2201/01

Abstract: Provided is a paste including: a metallic element-containing powder; an epoxy group-containing compound; and a curing agent, wherein a thermogravimetric reduction rate is 5% or less after heat curing at 180° C. The paste can be suitably used as a material for a magnetic core of an inductor or as a material for filling between conductors of a coil, and is capable of easily providing a formed body having excellent insulation properties.