公开(公告)号：US20220230918A1

公开(公告)日：2022-07-21

申请号：US17605138

申请日：2019-04-24

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Yoshinori EJIRI ,  Hideo NAKAKO ,  Yuki KAWANA ,  Motoki YONEKURA ,  Shinichirou SUKATA ,  Manabu ISHII ,  Masaru FUJITA ,  Michiko NATORI ,  Masahiro KIMURA ,  Ryo HONNA

IPC: H01L21/768 ,  H01L23/48

Abstract: An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.

公开(公告)号：US20220371087A1

公开(公告)日：2022-11-24

申请号：US17764273

申请日：2019-09-30

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Motohiro NEGISHI ,  Hideo NAKAKO ,  Michiko NATORI ,  Dai ISHIKAWA ,  Chie SUGAMA ,  Yuki KAWANA

IPC: B22F1/107 ,  B22F7/00 ,  B22F7/08 ,  H01L23/00

Abstract: A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.