公开(公告)号：US20210005529A1

公开(公告)日：2021-01-07

申请号：US16958067

申请日：2018-11-19

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN ,  THOMAS BIGL ,  EWGENIJ OCHS

IPC: H01L23/367 ,  H05K7/20 ,  H01L21/48 ,  H01L23/498

Abstract: A semiconductor assembly includes a semiconductor element having contacts on a first surface electrically connected with contacts of a carrier element by electrically conductive material. A second surface opposite the first surface has a convex curvature with a first radius or a concave curvature with a second radius. The second surface of the convex curvature or the second surface of the concave curvature is connected in a positive-fit manner to a cooling body surface of a concave cooling body curvature of the cooling body, and, during operation at a selected barrier layer temperature, the first radius of the convex curvature deviates by at most 10% from a third radius of the concave cooling body curvature, or the second radius of the concave curvature deviates by at most 10% from a fourth radius of the convex cooling body curvature.

公开(公告)号：US20190393187A1

公开(公告)日：2019-12-26

申请号：US16481758

申请日：2018-01-22

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN ,  THOMAS BIGL

IPC: H01L23/00 ,  H05K3/28 ,  H05K3/34 ,  H01L23/498 ,  H05K1/18

Abstract: The invention relates to a method (20) for producing an electric circuit (2) in which a circuit carrier (4) comprising a first contact surface (14) and a second contact surface (16) is provided. An insulating body (26) is placed on the circuit carrier (4), wherein the insulating body (26) at least partially covers the first contact surface (14) and the second contact surface (16), and the insulating body (26) comprises a recess (34) in the region of both contact surfaces (14, 16). A flowable electro-conductive medium (44) is introduced into the insulating body (26). The invention also relates to an electric circuit (2) and to a further method (60) for producing an electric circuit (2).

公开(公告)号：US20220208643A1

公开(公告)日：2022-06-30

申请号：US17617844

申请日：2020-06-05

Applicant: Siemens Aktiengesellschaft

Inventor： THOMAS BIGL ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  STEFAN PFEFFERLEIN

IPC: H01L23/373 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/34 ,  H01L25/07 ,  H01L21/48 ,  H01L25/00

Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

公开(公告)号：US20220007543A1

公开(公告)日：2022-01-06

申请号：US17290587

申请日：2019-10-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： THOMAS BIGL ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  EWGENIJ OCHS ,  PHILIPP OSCHMANN ,  STEFAN PFEFFERLEIN ,  ULRICH WETZEL

IPC: H05K7/20 ,  F28F21/08

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.