公开(公告)号：US20220130769A1

公开(公告)日：2022-04-28

申请号：US17122289

申请日：2020-12-15

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ching HO ,  Bo-Hao MA ,  Chee-Key CHUNG

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

公开(公告)号：US20250046771A1

公开(公告)日：2025-02-06

申请号：US18923016

申请日：2024-10-22

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Kong-Toon NG ,  Hung-Ho LEE ,  Chee-Key CHUNG ,  Chang-Fu LIN ,  Chi-Hsin CHIU

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.