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公开(公告)号：US20250046771A1
公开(公告)日：2025-02-06
申请号：US18923016
申请日：2024-10-22
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Kong-Toon NG , Hung-Ho LEE , Chee-Key CHUNG , Chang-Fu LIN , Chi-Hsin CHIU
Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
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公开(公告)号：US20230268328A1
公开(公告)日：2023-08-24
申请号：US18309756
申请日：2023-04-28
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Kong-Toon Ng , Hung-Ho Lee , Chee-Key Chung , Chang-Fu LIN , Chi-Hsin Chiu
CPC classification number: H01L25/105 , H01L21/568 , H01L24/82 , H01L24/81 , H01L24/24 , H01L24/16 , H01L25/50 , H01L2224/73209 , H01L2224/82005 , H01L2224/16145 , H01L2224/24153 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058
Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
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