公开(公告)号：US12057409B2

公开(公告)日：2024-08-06

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/3121 ,  H01L23/49822

Abstract: An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

公开(公告)号：US20230163082A1

公开(公告)日：2023-05-25

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L23/3121

Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.