公开(公告)号：US3843301A

公开(公告)日：1974-10-22

申请号：US33470873

申请日：1973-02-22

Applicant: SINTOKOGIO LTD

Inventor： NAGOYA I ,  KASAZAKI M ,  TERADA H

IPC: B22C9/03 ,  B29C51/10 ,  B29C51/18 ,  B29C17/04

CPC classification number: B22C9/03 ,  B29C51/10 ,  B29C51/18

Abstract: A vacuum sealed molding process and apparatus in which a covering sheet of synthetic resin is applied on a pattern fixed on a pattern plate at a first station, and this pattern plate is then transferred to a second station at which the pattern is removed after molding.