公开(公告)号：US20190393164A1

公开(公告)日：2019-12-26

申请号：US16236058

申请日：2018-12-28

Applicant: SK hynix Inc.

Inventor： Sung Mook LIM ,  Hye Won KIM ,  Won Duck JUNG

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/522 ,  H01L23/00

Abstract: A package substrate includes a core layer including a first surface and a second surface, which are opposite to each other. The package substrate also includes a power plane interconnection layer disposed on the first surface of the core layer and a ground plane interconnection layer disposed on the second surface of the core layer. The package substrate additionally includes an electromagnetic (EM) bandgap structure disposed in the core layer and electrically coupled between the power plane interconnection layer and the ground plane interconnection layer. The EM bandgap structure includes an EM bandgap via protruding from a portion of the power plane interconnection layer toward the ground plane interconnection layer. The EM bandgap structure further includes an EM bandgap cylindrical structure extending from a portion of the ground plane interconnection layer toward the power plane interconnection layer and surrounding a side surface of the EM bandgap via.