公开(公告)号：US20220348713A1

公开(公告)日：2022-11-03

申请号：US17642160

申请日：2020-09-24

申请人： SKC CO., LTD.

发明人： Young Min HEO ,  Ilho NOH ,  Sang Mook KIM ,  Byeong Jae LIM

IPC分类号： C08G63/199 ,  C08J5/18 ,  H05K1/03

摘要： A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.

公开(公告)号：US20220330423A1

公开(公告)日：2022-10-13

申请号：US17642143

申请日：2020-09-18

申请人： SKC CO., LTD.

发明人： Young Min HEO ,  Ilho NOH ,  Sang Mook KIM ,  Byeong Jae LIM

IPC分类号： H05K1/02 ,  H05K1/03 ,  C08L67/02 ,  C08G63/181

摘要： A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.