公开(公告)号：US20200286819A1

公开(公告)日：2020-09-10

申请号：US16296659

申请日：2019-03-08

Applicant: SKC Co., Ltd.

Inventor： Sung Jin KIM ,  Young-Ho RHO ,  Jin Cheol KIM ,  Byung Kyu JANG

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/15 ,  H01L21/48

Abstract: Disclosed are a packaging substrate and a semiconductor device. The semiconductor device comprises an element unit comprising a semiconductor element and a packaging substrate electrically connected to the element unit. By applying a glass substrate to the packaging substrate as a core substrate, connecting the semiconductor element and a motherboard can be closer to each other, so that electrical signals are transferred through as short a path, and significantly improved electrical properties such as a signal transfer rate could be achieved. Also, it is possible to prevent an occurrence of a parasitic element effect and to apply to a high-speed circuit device without additional insulating process.