PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING OF THE SAME

    公开(公告)号:US20200286819A1

    公开(公告)日:2020-09-10

    申请号:US16296659

    申请日:2019-03-08

    Applicant: SKC Co., Ltd.

    Abstract: Disclosed are a packaging substrate and a semiconductor device. The semiconductor device comprises an element unit comprising a semiconductor element and a packaging substrate electrically connected to the element unit. By applying a glass substrate to the packaging substrate as a core substrate, connecting the semiconductor element and a motherboard can be closer to each other, so that electrical signals are transferred through as short a path, and significantly improved electrical properties such as a signal transfer rate could be achieved. Also, it is possible to prevent an occurrence of a parasitic element effect and to apply to a high-speed circuit device without additional insulating process.

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