公开(公告)号：US20220148991A1

公开(公告)日：2022-05-12

申请号：US17580371

申请日：2022-01-20

Applicant: SOCIONEXT INC.

Inventor： Takumi IHARA ,  Masanori NATSUAKI

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor device includes a wiring board, a semiconductor chip arranged on the wiring board, and a plurality of bumps arranged between the wiring board and the semiconductor chip, wherein the wiring board includes a first conductor, a second conductor, a third conductor, a first via, a second via, and a third via, wherein the second conductor is arranged at a position closer to a center of the semiconductor chip than the first conductor is to the center, as seen in a thickness direction, the first conductor and the second conductor are arranged next to each other without another conductor interposed therebetween, as seen in the thickness direction, and a first distance between the first conductor and the second conductor is larger than a second distance between the first conductor and the third conductor.