公开(公告)号：US20160230307A1

公开(公告)日：2016-08-11

申请号：US14614861

申请日：2015-02-05

申请人： SOLARWORLD INDUSTRIES AMERICA INC.

发明人： Nathan STODDARD ,  Carroll MURPHY ,  Thomas KURRASCH ,  Bjoern SEIPEL

IPC分类号： C30B11/10 ,  C30B29/06 ,  C30B11/00

CPC分类号： C30B11/10 ,  C30B11/006 ,  C30B29/06

摘要： Apparatus and method for a production of silicon ingots, such as crucible-less production of silicon ingots, where a support with a seed layer and a liquid layer is gradually lowered in a temperature field with a vertical gradient to solidify the liquid layer in a controlled way.

摘要翻译： 用于制造硅锭的装置和方法，例如无晶硅锭的生产，其中具有种子层和液体层的支撑在垂直梯度的温度场中逐渐降低，以将受控的液体层固化 办法。

公开(公告)号：US20140263524A1

公开(公告)日：2014-09-18

申请号：US13795896

申请日：2013-03-12

申请人： SOLARWORLD INDUSTRIES AMERICA INC.

发明人： Nathan STODDARD ,  Bjoern SEIPEL

IPC分类号： B26F3/00

摘要： A method for cleaving wafers comprising the following steps: providing a slice of a crystalline material with at least a first plane side, providing at least one stressing means to be attached to said slice, wherein said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion different from that of the slice, attaching said stressing means to said first plane side of said slice to form a stack, inducing a thermal shear stress to said slice by applying a temperature change to said stack.

摘要翻译： 一种用于切割晶片的方法，包括以下步骤：提供具有至少第一平面侧的结晶材料切片，提供至少一个应力装置以附接到所述切片，其中所述至少一个应力装置是至少部分 由与所述切片不同的热膨胀系数的材料制成，将所述应力装置附接到所述切片的所述第一平面侧以形成堆叠，通过对所述堆叠施加温度变化来引起对所述切片的热剪切应力 。