公开(公告)号：US20220340794A1

公开(公告)日：2022-10-27

申请号：US17413565

申请日：2020-01-17

Applicant: SOLTRIUM ADVANCED MATERIALS TECHNOLOGY, LTD SHENZHEN

Inventor： Wen Shi ,  Fengzhen Sun ,  Delin LI

IPC: C09J163/10 ,  C08K3/08 ,  C08K9/02 ,  C08K7/18

Abstract: A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.