公开(公告)号：US20170306094A1

公开(公告)日：2017-10-26

申请号：US15515805

申请日：2015-09-29

Applicant: SOMAR CORPORATION

Inventor： Nao WATANABE

IPC: C08G73/10 ,  C09D179/08

CPC classification number: C08G73/1042 ,  C08G73/10 ,  C08G73/1007 ,  C09D179/08 ,  C09J179/08

Abstract: An object of the present invention is to provide a polyimide copolymer excelling in solder heat resistance and an adhesive property, and a molded article thereof. A polyimide copolymer is obtained by copolymerizing: (A) an acid dianhydride ingredient; (B) a diamine and/or diisocyanate ingredient represented by the following general formulas (1) to (3): where in the formulas, X is an amino group or an isocyanate group, each of R1 to R8 is independently a hydrogen atom, an alkyl group having a carbon number of 1 to 4, an alkenyl group having a carbon number of 2 to 4 or an alkoxy group having a carbon number of 1 to 4, at least one of R1 to R4 is not a hydrogen atom, and at least one of R5 to R8 is not a hydrogen atom; and (C) a diamine and/or diisocyanate ingredient having at least one kind selected from an ether group and a carboxyl group.