公开(公告)号：US12091508B2

公开(公告)日：2024-09-17

申请号：US16977714

申请日：2019-03-04

Applicant: Kaneka Americas Holding, Inc.

Inventor： Samuel Kyran ,  Hiroyuki Furutani

IPC: C09J179/08 ,  C08G73/10 ,  H01L21/68

CPC classification number: C08G73/1064 ,  C08G73/1042 ,  C08G73/1071 ,  C09J179/08 ,  C09J2400/143 ,  H01L21/68

Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.

公开(公告)号：US12031066B2

公开(公告)日：2024-07-09

申请号：US17840462

申请日：2022-06-14

Applicant: Well Ascent Electronic (Ganzhou) Co., Ltd.

Inventor： Huimin Ye ,  Zuomao Zhu

IPC: H01B7/02 ,  C09D161/16 ,  C09J161/16 ,  C09J179/08 ,  H01B3/42 ,  H01B13/14 ,  H01B1/02

CPC classification number: C09J179/08 ,  C09D161/16 ,  C09J161/16 ,  H01B3/427 ,  H01B13/145 ,  H01B1/02

Abstract: Example implementations include an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. A bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed.

公开(公告)号：US11945922B2

公开(公告)日：2024-04-02

申请号：US17276188

申请日：2018-11-22

Applicant: PI ADVANCED MATERIALS CO., LTD.

Inventor： Won Ho Son ,  Hyong Sop Jo

IPC: C08J5/18 ,  C08G73/10 ,  C08L79/08 ,  C09J7/10 ,  C09J179/08

CPC classification number: C08J5/18 ,  C08G73/1032 ,  C08G73/1046 ,  C08G73/1071 ,  C08L79/08 ,  C09J7/10 ,  C09J179/08 ,  C08J2379/08 ,  C08L2203/206 ,  C09J2479/08

Abstract: The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

公开(公告)号：US20190227243A1

公开(公告)日：2019-07-25

申请号：US16374011

申请日：2019-04-03

Applicant: CORNING OPTICAL COMMUNICATIONS LLC

Inventor： Adra Smith Baca ,  Rebecca Lynn Burt ,  Jeffrey Dean Danley ,  Darrin Max Miller ,  Dennis Craig Morrison

IPC: G02B6/38 ,  C09J161/02 ,  C09J171/08 ,  C09J179/08 ,  C09J181/04

CPC classification number: G02B6/3861 ,  C09J161/02 ,  C09J171/08 ,  C09J179/08 ,  C09J181/04

Abstract: A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.

公开(公告)号：US10035936B2

公开(公告)日：2018-07-31

申请号：US14955168

申请日：2015-12-01

Applicant: James B. Fraivillig

Inventor： James B. Fraivillig

IPC: C09J179/08 ,  H01L23/00 ,  C09J5/06 ,  H01L23/373 ,  C08G73/10 ,  C08K3/22 ,  C08K3/38 ,  C08K3/08 ,  C08K7/24

CPC classification number: C09J179/08 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08K2003/0806 ,  C08K2003/2227 ,  C08K2003/385 ,  C09J5/06 ,  C09J2479/08 ,  H01L23/3737 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/0381 ,  H01L2224/04026 ,  H01L2224/2731 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/83022 ,  H01L2224/8309 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83424 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01005 ,  H01L2924/0503 ,  H01L2924/05432 ,  H01L2924/07025 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/15724 ,  H01L2924/3512 ,  H01L2924/3641 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

公开(公告)号：US10011685B2

公开(公告)日：2018-07-03

申请号：US15068249

申请日：2016-03-11

Applicant: THE BOEING COMPANY

Inventor： Christopher H. Childers ,  Gregg R. Bogucki ,  Christopher S. Steinman ,  Stephen R. Heinz

IPC: H01B3/30 ,  C08G73/10 ,  C08K7/06 ,  C08K7/14 ,  C08L79/08 ,  C09J179/08 ,  C09D179/08 ,  C08J5/24 ,  C08J7/04 ,  B29C67/00 ,  B29C65/48 ,  B29C65/00 ,  B29K79/00 ,  B29K105/06 ,  B29K307/04 ,  B29K309/08 ,  B29L31/30 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: C08G73/1071 ,  B29C65/02 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/7394 ,  B29C66/742 ,  B29K2063/00 ,  B29K2079/085 ,  B29K2105/06 ,  B29K2105/167 ,  B29K2307/04 ,  B29K2309/08 ,  B29L2031/3076 ,  B29L2031/3082 ,  B29L2031/3085 ,  B33Y10/00 ,  B33Y70/00 ,  C08G61/127 ,  C08G73/105 ,  C08G2261/3442 ,  C08G2261/45 ,  C08G2261/60 ,  C08J5/24 ,  C08J7/047 ,  C08J2379/08 ,  C08K7/02 ,  C08K7/04 ,  C08K7/06 ,  C08K7/14 ,  C08L79/08 ,  C09D179/08 ,  C09J165/00 ,  C09J179/08

Abstract: Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

公开(公告)号：US10002813B2

公开(公告)日：2018-06-19

申请号：US14650594

申请日：2014-01-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Akira Shimada ,  Koichi Aoki

IPC: C09J179/08 ,  H01L23/29 ,  H01L23/495 ,  C09J163/00 ,  C08G59/40 ,  C09J9/00 ,  H01L23/373 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: H01L23/295 ,  C08G59/4042 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  C09J7/28 ,  C09J9/00 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2479/08 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49568 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/31721 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

公开(公告)号：US09796816B2

公开(公告)日：2017-10-24

申请号：US14886576

申请日：2015-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung Kun Cho ,  Kalinina Fedosya ,  Kovalev Mikhail ,  Androsov Dmitry ,  Won-Cheol Jung ,  Yoon Seok Ko

IPC: C08G73/14 ,  B32B15/00 ,  C09D179/08 ,  C09J179/08 ,  C08L79/08 ,  H01L51/00 ,  C08G69/32 ,  C08G73/10 ,  G02F1/1333

CPC classification number: C08G73/14 ,  C08G69/32 ,  C08G73/1042 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08 ,  G02F1/133305 ,  H01L51/0097 ,  Y02E10/549 ,  Y02P70/521

Abstract: A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: In Chemical Formula 1C and Chemical Formula 2, R5 to R13, and n3 to n8 are the same as in the specification.

公开(公告)号：US20170166784A1

公开(公告)日：2017-06-15

申请号：US14967353

申请日：2015-12-13

Applicant: James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

Inventor： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC: C09J9/00 ,  H01L25/00 ,  H01L23/00 ,  C09J183/04 ,  C09J11/06 ,  C09J179/08 ,  C09J179/04 ,  H01L25/065 ,  C09J11/04

CPC classification number: C09J9/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/041 ,  C08K5/5425 ,  C08K5/544 ,  C08K5/5465 ,  C08K5/548 ,  C08K7/24 ,  C08K2201/01 ,  C09J11/04 ,  C09J11/06 ,  C09J179/04 ,  C09J179/08 ,  C09J183/04 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/11831 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/1369 ,  H01L2224/16147 ,  H01L2224/27444 ,  H01L2224/27452 ,  H01L2224/27612 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83895 ,  H01L2224/9202 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06544 ,  Y10S977/742 ,  Y10S977/833 ,  Y10S977/843 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

公开(公告)号：US09650550B2

公开(公告)日：2017-05-16

申请号：US14263229

申请日：2014-04-28

Applicant: FUJI XEROX CO., LTD.

Inventor： Tsuyoshi Miyamoto ,  Kana Miyazaki

IPC: C08G73/00 ,  C09J7/00 ,  C09J179/08 ,  H01B3/30 ,  C09K19/56 ,  C09D179/08 ,  C08G73/10 ,  G02B1/04

CPC classification number: C09J179/08 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09D179/08 ,  C09J2479/08 ,  C09K19/56 ,  G02B1/04 ,  H01B3/306 ,  C08L33/24 ,  C08K5/17 ,  C08K5/357 ,  C08K5/3445 ,  C08K5/3435

Abstract: A polyimide precursor composition includes a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic amine compound, and an acyclic aliphatic amine compound, wherein the resin, the cyclic amine compound, and the acyclic aliphatic amine compound are dissolved in an aqueous solvent: wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group.