公开(公告)号：US20250142269A1

公开(公告)日：2025-05-01

申请号：US18815292

申请日：2024-08-26

Applicant: SONOVA AG

Inventor： Fabio Schmidt ,  Petra Gunde ,  Manuel Weibel ,  Julia Lonsky ,  Jonas Meyer

IPC: H04R25/00

Abstract: An ear tip is described for retaining a hearing device or a hearing device part in an ear canal of a user wearing the hearing device or the hearing device part. The ear tip includes a sealing element with a sound channel providing for a sound path between a sound inlet opening for receiving an acoustic signal from an output unit of the hearing device or the hearing device part and a sound outlet opening for releasing the acoustic signal to the ear canal of the user wearing the hearing device or the hearing device part, and a first filtering element arranged in the sound channel between the sound inlet opening and the sound outlet opening.

公开(公告)号：US11647348B2

公开(公告)日：2023-05-09

申请号：US17416485

申请日：2018-12-21

Applicant: SONOVA AG

Inventor： Konstantin Silberzahn ,  Julia Lonsky

IPC: H04R1/10 ,  H04R25/00 ,  B29B13/02

CPC classification number: H04R25/659 ,  B29B13/023 ,  H04R25/30 ,  H04R25/609 ,  H04R25/554 ,  H04R2225/0216

Abstract: The disclosure relates to a device for preparing an earpiece for its customization, the device including an energy release unit comprising a receiving chamber for receiving the earpiece and configured to release energy into the receiving chamber. The disclosure further relates to a system for customizing an earpiece comprising the earpiece and the preparing device.

公开(公告)号：US20210315740A1

公开(公告)日：2021-10-14

申请号：US17269752

申请日：2018-08-20

Applicant: SONOVA AG

Inventor： Julia Lonsky ,  Konstantin Silberzahn ,  Erdal Karamuk

IPC: A61F11/08 ,  B33Y80/00 ,  H04R25/00

Abstract: The disclosure relates to an earpiece configured to be at least partially inserted into an ear and comprising a core comprising a material that during insertion of the earpiece into the ear is deformable above a transition temperature and non-deformable below the transition temperature. The disclosure also relates to a method of manufacturing the earpiece. The disclosure further relates to a method of customizing the earpiece.