公开(公告)号：US20210043676A1

公开(公告)日：2021-02-11

申请号：US17068783

申请日：2020-10-12

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20160218135A1

公开(公告)日：2016-07-28

申请号：US15087894

申请日：2016-03-31

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/1469

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20200035744A1

公开(公告)日：2020-01-30

申请号：US16555067

申请日：2019-08-29

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20190229145A1

公开(公告)日：2019-07-25

申请号：US16373105

申请日：2019-04-02

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20180350867A1

公开(公告)日：2018-12-06

申请号：US16042094

申请日：2018-07-23

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20180122850A1

公开(公告)日：2018-05-03

申请号：US15852468

申请日：2017-12-22

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/1469

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

公开(公告)号：US20170148839A1

公开(公告)日：2017-05-25

申请号：US15403154

申请日：2017-01-10

Applicant: SONY CORPORATION

Inventor： Taku UMEBAYASHI ,  Keiji TATANI ,  Hajime INOUE ,  Ryuichi KANAMURA

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/1469

Abstract: A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.