公开(公告)号：US10720402B2

公开(公告)日：2020-07-21

申请号：US15316574

申请日：2015-06-05

Applicant: SONY CORPORATION

Inventor： Makoto Murai ,  Kazuki Sato ,  Hiroyuki Yamada ,  Yuji Takaoka ,  Makoto Imai ,  Shigeki Amano

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/065

Abstract: A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, and one or more conductive layers and a solder resist layer that are provided on a front surface of the substrate body. The solder resist layer is provided as a continuous layer on the front surface of the substrate body and the one or more conductive layers, and has one or more apertures on each of the one or more conductive layers. The plurality of solder-including electrodes include two or more first electrodes having a same function other than a function of power supply. The one or more conductive layers include a continuous first conductive layer. The two or more first electrodes are connected to the continuous first conductive layer. The one or more apertures are confronted with the respective two or more first electrodes.