公开(公告)号：US20230263060A1

公开(公告)日：2023-08-17

申请号：US18005070

申请日：2021-06-08

Applicant: SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： KOSUKE HAREYAMA ,  CHRISTOPHER WRIGHT ,  MATTHEW LAWRENSON ,  BERNADETTE ELLIOTT-BOWMAN ,  TIMOTHY BEARD

IPC: H10N10/17 ,  H10N10/01

CPC classification number: H10N10/17 ,  H10N10/01

Abstract: Provided is a thermoelectric power generation module that uses a thermoelectric power generation element and, for example, improves the efficiency of thermoelectric power generation according to heat generated by a semiconductor component, etc.
The thermoelectric power generation module includes a heat-dissipating body that dissipates heat generated by a heat-generating body, a thermoelectric power generation element disposed at an approximately central section of a top surface of the heat-dissipating body, and a thermally-responsive body that is disposed on an outer peripheral section of the top surface of the heat-dissipating body and whose thermal resistance changes according to temperature, the thermoelectric power generation element and the thermally-responsive body being disposed on a bottom surface of the heat-generating body, and the thermally-responsive body being formed such that the thermal resistance of the thermally-responsive body becomes larger than that for the thermoelectric power generation element when the heat-generating body has a low temperature and that the thermal resistance of the thermally-responsive body becomes equal to or smaller than that for the thermoelectric power generation element when the heat-generating body has a high temperature.

公开(公告)号：US20230291999A1

公开(公告)日：2023-09-14

申请号：US18003763

申请日：2021-05-27

Applicant: SONY GROUP CORPORATION

Inventor： YUGO SATO ,  HARM CRONIE ,  MATTHEW LAWRENSON

IPC: H04N23/60 ,  G06T7/50 ,  G06T7/70 ,  G06V10/70

CPC classification number: H04N23/64 ,  G06T7/50 ,  G06T7/70 ,  G06V10/70 ,  G06T2207/30204 ,  G06T2207/10028

Abstract: Acquisition of a three-dimensional shape of an object by a user is efficiently supported. There is provided an information processing device including a control unit that controls presentation of feedback related to arrangement of a plurality of mirror surfaces arranged around an object to be imaged and used for acquiring a three-dimensional shape of the object. Furthermore, there is provided an information processing method including controlling, by a processor, presentation of feedback related to arrangement of a plurality of mirror surfaces arranged around an object to be imaged and used for acquiring a three-dimensional shape of the object.

公开(公告)号：US20230075929A1

公开(公告)日：2023-03-09

申请号：US17904390

申请日：2021-01-15

Applicant: SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： JO UMEZAWA ,  MATTHEW LAWRENSON ,  BERNADETTE ELLIOTT-BOWMAN ,  CHRISTOPHER WRIGHT ,  TIMOTHY BEARD

IPC: H01L23/00

Abstract: An object of the present technology is to prevent damage in a bonded portion between a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate.
A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element and the electrode of the substrate. The terminal includes a plurality of unit lattices and a coupling portion. The unit lattices included in the terminal are formed by bonding a plurality of beams in a cube shape. The coupling portion included in the terminal couples adjacent unit lattices among the plurality of unit lattices.