公开(公告)号：US20240030102A1

公开(公告)日：2024-01-25

申请号：US18256496

申请日：2021-12-02

Applicant: SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hikaru OHIRA ,  Yoichiro FUJINAGA ,  Christopher WRIGHT ,  Jan Jasper VAN DEN BERG ,  Matthew LAWRENSON

IPC: H01L23/473 ,  H01L23/40 ,  H01L21/78 ,  H01L21/48 ,  H01L21/02

CPC classification number: H01L23/473 ,  H01L23/40 ,  H01L21/78 ,  H01L21/481 ,  H01L21/02112

Abstract: Conventional problems are solved by providing a cooling mechanism having a nanocapillary structure constituted by graphene, a semiconductor device including the cooling mechanism, a method for manufacturing the same, and an electronic device. A first metal layer, a first graphene layer formed on the first metal layer and having a nanocapillary channel, a second graphene layer joined to an upper surface of the nanocapillary channel to form an opening of a passage for a refrigerant, and a second metal layer covering the second graphene layer are included.

公开(公告)号：US20230222738A1

公开(公告)日：2023-07-13

申请号：US17922919

申请日：2021-04-27

Applicant: SONY GROUP CORPORATION

Inventor： Junji OTSUKA ,  Matthew LAWRENSON ,  Harm CRONIE

IPC: G06T19/00 ,  G02B27/01

CPC classification number: G06T19/006 ,  G02B27/017

Abstract: Provided is an information processing apparatus (500) including a control section (504) that dynamically changes each parameter related to display of a virtual object, the parameter controlling display of the virtual object on each display device according to a method of expressing an image, the method being assigned for display of the image to each of a plurality of display devices that display images related to the same virtual object.

公开(公告)号：US20230298955A1

公开(公告)日：2023-09-21

申请号：US17916131

申请日：2021-03-05

Applicant: SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Shigekazu ISHII ,  Bernadette ELLIOTT-BOWMAN ,  Christopher WRIGHT ,  Timothy BEARD ,  Matthew LAWRENSON ,  Hirotaka KOBAYASHI ,  Hiroyuki SHIGETA

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/315 ,  H01L23/3142 ,  H01L23/49816 ,  H01L2924/186

Abstract: A region of a sealing part is effectively utilized. -A semiconductor device includes a semiconductor element, a substrate, a sealing part, and a cavity region. The substrate included in this semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The sealing part included in this semiconductor device is formed in a shape that covers an upper surface that is a surface facing the bottom surface of the semiconductor element, and seals the semiconductor element. The cavity region included in this semiconductor device is a region disposed in the sealing part and formed with a cavity.