公开(公告)号：US20180286714A1

公开(公告)日：2018-10-04

申请号：US15531997

申请日：2015-12-21

Applicant: SOUTH CHINA NORMAL UNIVERSITY

Inventor： Miao HE ,  Yuanyuan ZHANG

IPC: H01L21/67 ,  H01L21/677 ,  H01L23/00 ,  G06F17/50

Abstract: Disclosed is a COB die bonding and wire bonding system and method. The system comprises a controller, a forward die bonder, a reverse die bonder and a conveyor belt, the controller being connected with the forward die bonder and the reverse die bonder respectively, and the forward die bonder is associated with the reverse die bonder by the conveyor belt. The system and method can realize the combination of the forward and reverse bonding when using the forward die bonder and the reverse die bonder to fix the chips, thus the amount of gold wire used for connecting chips on a substrate is minimized. The COB die bonding and wire bonding system and method can be widely used in the field of electronics.