公开(公告)号：US20040091633A1

公开(公告)日：2004-05-13

申请号：US10699911

申请日：2003-11-03

Applicant: SPDI, Inc.

Inventor： John W. Wilson II ,  Robert H. Schenk

IPC: C08J007/18 ,  B23K009/00

CPC classification number: C09J5/02 ,  B05D3/08 ,  B05D3/144 ,  B29C59/08 ,  B29C59/085 ,  B29C59/10 ,  B29C59/103 ,  Y02P20/582

Abstract: A process and apparatus for substantially enhancing surface-bonding properties of a substrate simultaneously. The process includes depositing combustion ions upon the substrate substantially immediately upon generation of the combustion ions; and depositing corona ions upon the substrate substantially immediately upon generation of the corona ions. The present invention is advantageously cylindrical and other three-dimensional substrates.

Abstract translation: 用于同时显着提高基材的表面粘合性能的方法和装置。 该方法包括：在产生燃烧离子后立即将燃烧离子沉积在基底上; 并且基本上立即在产生电晕离子时立即将电晕离子沉积在基底上。 本发明有利地是圆柱形和其它三维基底。