公开(公告)号：US20250125158A1

公开(公告)日：2025-04-17

申请号：US18914058

申请日：2024-10-12

Applicant: STATS ChipPAC Pte. Ltd

Inventor： YongHyuk JEONG ,  JinHee JUNG ,  GwangTae KIM

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373

Abstract: A method for attaching a heat spreader to a semiconductor package is provided. The method comprises: providing a semiconductor package, wherein the semiconductor package comprises a package substrate, a semiconductor component mounted on the package substrate and a mold cap formed on the package substrate and encapsulating the semiconductor component, and wherein the mold cap comprises a laser-activatable mold compound; removing a portion of a thickness of the mold cap above the semiconductor component by laser ablation to form a cavity in the mold cap and transform the laser-activatable mold compound at an inner surface of the cavity to a conductive layer; dispensing a thermal interface material (TIM) in the cavity to form on the conductive layer a TIM layer that protrudes from the mold cap; and attaching the heater spreader to the semiconductor package at least through the TIM layer.