公开(公告)号：US20250125158A1

公开(公告)日：2025-04-17

申请号：US18914058

申请日：2024-10-12

Applicant: STATS ChipPAC Pte. Ltd

Inventor： YongHyuk JEONG ,  JinHee JUNG ,  GwangTae KIM

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373

Abstract: A method for attaching a heat spreader to a semiconductor package is provided. The method comprises: providing a semiconductor package, wherein the semiconductor package comprises a package substrate, a semiconductor component mounted on the package substrate and a mold cap formed on the package substrate and encapsulating the semiconductor component, and wherein the mold cap comprises a laser-activatable mold compound; removing a portion of a thickness of the mold cap above the semiconductor component by laser ablation to form a cavity in the mold cap and transform the laser-activatable mold compound at an inner surface of the cavity to a conductive layer; dispensing a thermal interface material (TIM) in the cavity to form on the conductive layer a TIM layer that protrudes from the mold cap; and attaching the heater spreader to the semiconductor package at least through the TIM layer.

公开(公告)号：US20250054925A1

公开(公告)日：2025-02-13

申请号：US18749657

申请日：2024-06-21

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongHyuk JEONG ,  DaAe LEE ,  EunByeol SON

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor package is provided, comprising: a package substrate; a first plurality of semiconductor dice disposed on a front side of the package substrate; an embedded sub-package disposed on a back side of the package substrate, comprising: a sub-package substrate, wherein a front side of the sub-package substrate is attached to the back side of the package substrate; an interconnection layer attached to a back side of the sub-package substrate, comprising a second plurality of vertical interconnection portions and at least one horizontal interconnection portion; and a second plurality of semiconductor dice disposed on the back side of the sub-package substrate through the interconnection layer; and a first plurality of vertical interconnection portions disposed on the back side of the package substrate; and solder bumps attached to the first plurality of vertical interconnection portions.